BOJIONG is a leading China Machine Vision Inspection manufacturer, supplier and exporter. Have a strong technical team and after-sales service guarantee.Adhering to the pursuit of perfect quality of products, so that our Machine Vision Inspection have been satisfied by many customers. Extreme design, quality raw materials, high performance and competitive price are what every customer wants, and that's also what we can offer you. Of course, also essential is our perfect after-sales service. You can rest assured to buy customized Machine Vision Inspection from us. We look forward to cooperating with you, if you want to know more, you can consult us now, we will reply to you in time!
Machine Vision Inspection advantages: Based on circular micro-scattering dark field imaging, resolution up to 0.5μm, high and low power scanning combination, to achieve a large range of high-precision detection, macro-scale micro-defect detection, automatic planning according to the surface shape of the subaperture scanning, automatic output digital reports, compatible with national standards, military standards, international tables, statistical reports, etc. AI Deep learning is based on machine learning theory, through a hierarchical learning process that extracts high-level, complex abstractions as data representations, deep learning methods produce results faster than standard machine learning methods. It is suitable for automatic detection of appearance defects in Machine Vision Inspection.
The automatic, high-speed and high-precision detection of glass and metal surface defects can be realized by using Machine Vision Inspection, which can effectively solve the problem of low efficiency and poor accuracy of visual detection. It is suitable for the surface defect quality control of mobile phone screen, display screen, optical component, low-light component, metal product surface, silicon wafer, etc. The device can output reports automatically in the following formats: U.S.Miitary Standard MIL-PRF-13830A/B, ISO10110-7, GB/T 1185-2006. For optical components, wafer surface nanometer, sub-micron defect detection and spherical, aspherical surface defect detection at sub-micron level.
